| 1. | Specification for glass - to - metal headers used in electron devices
电子器件用玻璃.金属接头规范 |
| 2. | Determining hermeticity of electron devices by dye penetration
用染料渗透法测定电子器件的密封性 |
| 3. | Standard specification for tungsten wire for electron devices and lamps
电子器件和电灯用钨丝标准规范 |
| 4. | Standard specification for brazing filler metals for electron devices
电子器件用金属铜焊料的标准实施规范 |
| 5. | Standard specification for tungsten - rhenium alloy wire for electron devices and lamps
电子器件及灯泡用钨铼合金丝 |
| 6. | Standard specification for oxygen - free copper in wrought forms for electron devices
电气设备用锻造成形无氧铜标准规范 |
| 7. | Vacuum electron device
真空电子器件 |
| 8. | Standard test methods of testing fine round and flat wire for electron devices and lamps
电子器件和电灯用细圆丝和扁线的试验方法 |
| 9. | Test method for apparent density of ceramics for electron device and semiconductor application
电子器件及半导体设备用陶瓷表观密度的试验方法 |
| 10. | Standard specification and test method for evaluation of glass - to - metal headers used in electron devices
电子设备用玻璃金属底板评定标准规范和试验方法 |
